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August 16, 2006
Swiss Synova Raises Capital For Semiconductor Equipment Expansion
Synova, a Swiss company that sells equipment to cut up wafers into chips using an innovative water jet-guided laser technology, said it had raised financing SFr 10M ($8.1M) from "Swiss banks".
The type of financing was undisclosed, but we doubt it is equity financing as most Swiss banks dropped their venture capital funds four years ago.
Synova, founded in 1997, and based in Lausanne, said it will use the capital to open up a couple demo and development centers, one of which will be in Silicon Valley. Its technology is used to squeeze more dies out of a wafer, which is important in pricey LED chips and some of the higher end semiconductor devices.
There are two other ventures that are based in Europe that offer competing technologies, ALSI, which is backed by Falk Strascheg, a Munich-based venture capital and institutional investor, and XSIL, has been funded by its founder, Peter Conlon, who sold his last venture to Agilent for €100M in cash.
The press section of the websites of these have not been updated in over a year, so we cannot tell you if business is booming or if they are losing out to Synova in this niche of the semiconductor manufacturing equipment sector.
Read - Synova Secures CHF 10 Million (USD 8.1 Million) to Drive Global Expansion Efforts (prnewswire)
Posted on August 16, 2006 10:06 AM | Posted to News And Updates | Semiconductor Manufacturing Equipment | Permalink
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