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January 05, 2007
Chip Packager Hymite Closes Series B At €9M
Back in July Danish-German semiconductor packaging solutions provider, Hymite A/S, announced an €8M first closing on its Series B round. It has just added another €1M in the meantime, for a total of €9M.
Early investors TVM Capital (Germany) and InnovationsKapital (Sweden), as well as Danish VCs, Dansk Kapitalanlæg, Vaekstfonden, and IVS are backing the deal.
The new capital will be spent on hiring sales teams, marketing, and building up its manufacturing infrastructure using external foundries.
The company is growing fast on selling packaging solutions for high-brightness LEDs and MEMS, two areas of semiconductor industry going into steep growth curves. It sells the equipment for packaging and also provides services.
Read - Fast Growing (press release)
Posted on January 5, 2007 06:40 PM | Posted to News And Updates | Permalink
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